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Showing posts with label copper. Show all posts
Showing posts with label copper. Show all posts

Monday, October 27, 2014

Electroform it right the first time

Q: I am experiencing blistering when I electroform copper over aluminum substrate. What could be the root cause? 

A: This question came from a company producing tight tolerance parts for radio applications. Before I answer what the root cause was I think it prudent to do a quick overview of the electroform process, shown below. By nature of the process, rework is very expensive; As soon as the aluminum is dissolved the part can no longer be stripped and replated and a new mandrel must be made. Therefore it is critical to ensure that all chemical processes are working properly. By focusing on improving first pass yield the cost of manufacturing can be significantly reduced.

 In this particular case we discovered that oil contamination was the culprit. Although the manufacturer had focused on improving their alkaline cleaning process, drag-out propagated the issue throughout all the plating tanks. Only when proper rinsing (i.e. cascading overflow rinses) was practiced throughout the whole line was the issue resolved.

Wednesday, September 10, 2014

Gold copper intermetallic

Q: I gold plate copper alloys and over time my customers are returning parts because the gold is changing color. How can I fix this issue? 


A: Plating over these substrates presents an interesting problem. Copper has a tendency to migrate into gold and form an intermetallic (or alloy). This causes discoloration over time. To avoid this I recommend first plating 100 microinches of nickel over the substrate as a barrier layer. In addition, utilize sufficient agitation and gold content in the tank. I recommend 0.5 oz./gal to ensure a smooth and consistent deposit.